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Reactive Polyimide GPI series

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‘GPI’ is brandnew and unique material, featuring phenolic resin and  polyimide as unique polymer character.

Polyimide is known to have excellent heat resistance and mechanical properties. However it is also true that Polyimide has some difficulties regarding workability due to its insolubility and non-melting factors.
GPI is solution for the above-mentioned problem. In addition GPI add new functions, then you can spread your imagination by using this GPI.

Features
  • The chemical structure of GPI has already circularized, so it is superior in preservation stability. You can preserve at normal temperature.
  • GPI has high solubility for various solvents
  • You can easily produce film on various type of materials, such as plastics or metals.
  • The phenolic hydroxyl group in chemical structure brings almost same reactivity as usual phenolic resins even polyimide shows lower reactivity.
  • High heat resistance
  • High adhesion on film
  • High water resistance
  • Easy preservation
  • Easy workability
  • Easy modifications
Consult Details
Preservation stability

Circularized structure brings it to preserve easily at room temperature.

Solvent solubility

GPI has high solubility for various solvents.

Solvent type Name of solvents
Containing Nitrogen NMP, DMF, DMAC
Ketone MEK, MIBK, Cyclohexanone
Alcohol Benzylalcohol, BC
Others THF, Phenol, BCA
Film workability

GPI can dry at temperature of Boiling Point of above-mentioned solvents. For example, in the case of MIBK solution, you can easily dry the film at 120℃ on the PET film.
And GPI film shows high adhesion then heat pressure lamination is possible on various materials.

Ability of the modification

The phenolic hydroxyl group in GPI structure brings almost same reactivity as usual phenolic resins.
That’s why GPI reacts with general epoxy resins as shown below.

Consult Product List
Line up of GPI series
item unit GPI-NT GPI-HT GPI-LT GPI-LM
Type Non-Thermoplastic High heat resistance High elongation Low elastic modulus
Non-volatile % 20 30 35 40
Solvent type - NMP
DMAC
THF
MEK
MIBK
Cyclohexznone
MIBK
Cyclohexznone
MIBK
BC
BCA
Cyclohexznone
Prevention condition ≦ 25 ≦ 25 ≦ 25 ≦ 25
T.g. - 200 150 55
5% Thermal
decomposition
405 410 445 410
Elastic modulus GPa 2.0 1.0 0.5 0.005
Peel adhesive N/cm 11 14 18 11
Elongation % 4.0 7.0 200 315
Water absorption
(121℃/24hours)
% 0.9 0.9 0.8 0.7

We can provide not only the above-mentioned products,
but your required products if we can develop.

Please contact us to order for more information.

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Inquiries regarding products and solutions

Functional Materials Sales Section (Tokyo Branch)
1-14-4 Kyobashi, Chuo-ku,
Tokyo 104-0031, Japan
TEL +81-3-3567-5081

Functional Materials Sales Section (Osaka Branch)
2-2-17 Shibata, Kita-ku,
Osaka-shi, Osaka 530-0012, Japan
TEL +81-6-6373-3281

Inquiries/Requests for Materials

Inquiries

Inquiries regarding company information accepted via phone and e-mail.

Functional Materials Sales Section (Tokyo Branch)
1-14-4 Kyobashi, Chuo-ku,
Tokyo 104-0031, Japan
TEL +81-3-3567-5081

Functional Materials Sales Section (Osaka Branch)
2-2-17 Shibata, Kita-ku,
Osaka-shi, Osaka 530-0012, Japan
TEL +81-6-6373-3281

Inquiries/Requests for Materials

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